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| 대만 TSMC 본사 (사진=연합뉴스) |
[Alpha Biz=(Chicago) Reporter Kim Jisun] TSMC has teamed up with EO Technics in Korea.
In particular, it has been confirmed that the technology that has been handed over is a next-generation semiconductor back-end process. As a result, Korea's native semiconductor technology can surpass global standards.
Summarizing the coverage of the Alpha economy on the 4th, TSMC will use EO Technics' next-generation picosecond grooving equipment for grooving (half-cutting) equipment to enter the semiconductor back-end process made in its 3-nano, 4-nano, and 5-nano advanced micro-processes. Confirmed.
"The grooming we are currently using is Japanese disco equipment as nanosecond grooming," said an official at a global IT company who asked for anonymity. "I understand that we have decided to use EO Technics mass production equipment for picosecond grooming, which is the same as hybrid bonding in the front-end process such as AI semiconductors."
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| TSMC 반도체 생산라인 (사진=TSMC) |
TSMC is said to have inspected EO Technics with a number of customer evaluations, including Apple, its biggest customer, for the final decision. "Recently, laser equipment has been required to be more precise that it can be called a war against parties," said Yoon Joo-ho, CEO of Umbrella Research. "With TSMC's decision to use EO Technics grooming, Korea has been able to move beyond the world's standard position in the field of next-generation adventure packaging." Japan's disco, which has not been chosen for TSMC, has dominated the semiconductor cutting market for the past 30 years. Disco leads the diamond wheel market and the next generation laser cutting market, As the company is suffering from EO Technics in next-generation grooming equipment, it is expected that it will struggle in supply competitions of other semiconductor companies such as Samsung Electronics.
Alphabiz Reporter Kim Jisun(stockmk2020@alphabiz.co.kr)
