SK Hynix has announced a collaboration with TSMC on next-generation HBM (High Bandwidth Memory) technology.

SK Hynix has announced a collaboration with TSMC on next-generation HBM (High Bandwidth Memory) technology.: COMPANY / Reporter Kim Jisun / 2024-07-10 03:19:35

SK Hynix. (Photo=SK Hynix)

[Alpha Biz= Reporter Kim Jisun] SK Hynix is set to showcase its AI memory technology in Taiwan this September.

On the 9th, industry sources reported that Ju-Seon Kim, Head of AI Infrastructure at SK Hynix, will deliver a keynote speech at "Semicon Taiwan" in Taipei on September 4th. This marks the first time SK Hynix will present a keynote at Semicon Taiwan.

Semicon Taiwan is the largest semiconductor industry exhibition in Taiwan, hosted by the International Semiconductor Equipment and Materials Association (SEMI). The event will gather around 1,000 global companies, including Taiwan-based firms like TSMC, to exhibit semiconductor materials, equipment, and related technologies.

SK Hynix is strengthening its collaboration with TSMC for the development and mass production of next-generation customized HBM (High Bandwidth Memory). In April, the two companies signed a memorandum of understanding (MOU) to collaborate on the development of the sixth-generation high bandwidth memory, HBM4.

For HBM4, SK Hynix plans to leverage TSMC's advanced logic process for base die production to enhance performance. The company aims to begin mass production of HBM4 by 2025, based on this collaboration.