[Alpha Biz= Kim Jisun] Samsung Electro-Mechanics has secured a key role in supplying advanced semiconductor substrates for next-generation AI chips developed by NVIDIA.

According to industry sources on April 8, Samsung Electro-Mechanics will provide flip-chip ball grid array (FC-BGA) substrates for NVIDIA’s Groq 3 language processing unit (LPU). The Groq 3 LPU is an inference-focused chip expected to be integrated into NVIDIA’s next-generation AI architecture, “Vera Rubin.”

Samsung Electro-Mechanics has reportedly secured first-vendor status for FC-BGA substrates used in the Groq 3 LPU and is preparing to begin mass production as early as the second quarter of this year.

FC-BGA is a high-density package substrate that connects semiconductor chips to mainboards using flip-chip bump technology. It is a critical component widely used in AI servers and high-performance computing (HPC) systems.

The company is already supplying server-grade FC-BGA substrates to AMD, and industry observers suggest that its substrates may also be adopted in Tesla’s future autonomous driving AI chip, “AI6.”

Meanwhile, the Groq 3 LPU is being manufactured using a 4-nanometer process by Samsung Electronics’s foundry business.

 

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