[Alpha Biz= Kim Jisun] Seoul, July 13, 2025 — LG Electronics has officially begun development of a hybrid bonder for High Bandwidth Memory (HBM), marking its entry into the advanced semiconductor equipment market. HBM, often referred to as a "dream semiconductor," is a critical component for high-performance AI computing, a priority growth area for LG Group Chairman Koo Kwang-mo.



According to industry sources, LG Electronics' Production Engineering Research Institute (PRI) has initiated R&D on hybrid bonding equipment used in next-generation HBM production. The company aims to begin mass production of the hybrid bonder by 2028.



“It’s true that we are currently conducting research and development on hybrid bonder technology,” an LG official confirmed.



To accelerate the project, LG Electronics is expanding its semiconductor packaging R&D unit and actively recruiting talent specialized in the field. The company is also pursuing academic partnerships, including a joint research project with Inha University’s hybrid bonding team.



What Is a Hybrid Bonder?

A hybrid bonder is cutting-edge equipment used to vertically bond multiple semiconductor chips without the use of traditional solder bumps, unlike conventional thermocompression (TC) bonders. The result is thinner, more efficient chip stacks with improved heat dissipation—ideal for multi-layered DRAM packages like HBM.



While the technology has been partially commercialized in NAND flash and logic semiconductors, it has yet to be implemented in HBM manufacturing. LG sees this as a first-mover opportunity, with the potential to not only generate revenue quickly upon successful development, but also to emerge as a leading player in the global semiconductor equipment industry.



If successful, LG Electronics could count SK hynix, Micron, and Samsung Electronics among potential customers. The move also aligns with LG’s strategic shift toward B2B business expansion, which has already shown results in areas like automotive electronics and HVAC systems—sectors expected to generate over KRW 20 trillion in revenue this year, rivaling LG's traditional home appliance division.



LG Electronics will be competing with industry leaders including Samsung Electronics, Hanwha Semitec, and Hanmi Semiconductor in what is shaping up to be a fiercely contested segment of the advanced manufacturing space.

 

 

 

 

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