[Alpha Biz= Paul Lee] Samsung Electronics will manufacture Apple’s next-generation chip at its semiconductor foundry in the United States.



On August 7, Apple announced in a press release that it is collaborating with Samsung at the company’s semiconductor facility in Austin, Texas, to develop an innovative chip manufacturing technology that is being implemented for the first time globally.



“By introducing this technology in the U.S. first, the facility will supply chips that optimize power efficiency and performance for Apple products, including iPhones shipped worldwide,” the company stated.



Industry sources speculate that the chip in question is a next-generation image sensor (CIS) intended for future iPhones.



According to Park Yoo-ak, an analyst at Kiwoom Securities, “Samsung’s semiconductor business is expected to reduce its operating losses by beginning mass production of image sensors for the iPhone 18 next year and securing new clients such as Tesla.”



Samsung’s ISOCELL-branded image sensors are designed by its System LSI division and will be manufactured at the Austin foundry. ISOCELL sensors are made by bonding two wafers together, and the Austin plant is expected to produce chips utilizing the latest technology. The Austin facility has been operational since 1998.



Currently, Samsung supplies its ISOCELL sensors to its own Galaxy smartphones, as well as to Chinese brands such as Xiaomi, Vivo, and Motorola.



Apple reportedly selected Samsung as a partner as part of its broader strategy to localize production in the U.S., while also aiming to diversify its supply chain. Until now, Apple has exclusively sourced image sensors for the iPhone from Japan’s Sony. As of last year, Sony led the global image sensor market with over 50% share, followed by Samsung with 15.4%.



When asked for comment, a Samsung spokesperson said, “We cannot disclose details regarding specific customers.”

 

 

 

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