Paul Lee Reporter
hoondork1977@alphabiz.co.kr | 2026-03-18 05:14:01
[Alpha Biz= Paul Lee] Nvidia CEO Jensen Huang visited the booths of Samsung Electronics and SK Hynix at GTC 2026 in San Jose on March 16 (local time), offering high praise for both companies’ advanced memory technologies.
Huang visited Samsung Electronics’ booth around 5 p.m., where he met Jo Sang-yeon, Executive Vice President and Head of Device Solutions America (DSA). “Samsung is the best in the world,” Huang said, adding, “This is a great partnership.”
When Jo introduced Samsung’s newly mass-produced HBM4 core die as “the world’s best HBM4 currently available,” Huang responded, “Do you need approval?” before signing the product with the message “Amazing HBM4!”
He also signed other exhibits, including a Groq chip wafer manufactured by Samsung Foundry—writing “Groq super fast”—and the Vera Rubin platform. As he left the booth, Huang exclaimed, “Let’s go, Samsung. The next is coming.”
At this year’s GTC, Samsung Electronics unveiled its HBM4E physical chip and core die wafer for the first time. The company highlighted that its HBM4E—offering speeds of 16Gbps per pin and bandwidth of 4.0TB/s—positions it as the only supplier capable of providing memory for Nvidia’s Vera Rubin platform.
On the second day of the event, Samsung Electronics is scheduled to present its “memory total solution” vision on Nvidia’s stage, led by Song Yong-ho, head of the Samsung AI Center.
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